Kalrez® 9500 FFKM Material Data Sheet

Kalrez® 9500 is a high-performance perfluoroelastomer (FFKM) compound engineered for semiconductor deposition processes where ozone, ammonia, and water vapor are present. Specifically designed for applications such as Sub-Atmospheric Chemical Vapor Deposition (SACVD), Flowable Chemical Vapor Deposition (FCVD), and PECVD curing processes, Kalrez® 9500 delivers exceptional sealing performance in highly reactive plasma environments while helping reduce contamination and extend seal life.

Designed for plasma environments dominated by oxygen and fluorine radicals, Kalrez® 9500 offers outstanding thermal stability, ultra-low outgassing, low metals content, and excellent mechanical strength. Its advanced formulation minimizes erosion and particle generation, making it an ideal sealing solution for contamination-sensitive semiconductor manufacturing. Each part is ultrapure cleaned and packaged to support today’s advanced wafer fabrication processes.

Download the Kalrez® 9500 Technical Data Sheet

Review the technical data sheet below for detailed information regarding material properties, operating temperatures, plasma resistance, and recommended semiconductor applications. If you need assistance selecting the right Kalrez® compound for your process, the sealing specialists at M&P Sealing are available to help identify the best solution for your application.