Kalrez® 9300 FFKM Material Data Sheet

Kalrez® 9300 is a high-performance perfluoroelastomer (FFKM) compound engineered for semiconductor dielectric (oxide) etch applications that require exceptional plasma resistance, low particle generation, and long-term sealing reliability. Specifically formulated for plasma environments containing both physical ion bombardment and chemical radicals, Kalrez® 9300 delivers outstanding performance in demanding semiconductor fabrication processes while helping reduce contamination and extend seal life.

Designed with very low metals content, excellent thermal stability, and strong mechanical properties, Kalrez® 9300 performs exceptionally well in oxygen- and fluorine-based plasma environments. Its advanced formulation helps minimize erosion and particle generation, making it an ideal choice for contamination-sensitive semiconductor manufacturing. Each seal is ultrapure cleaned and packaged to support critical wafer fabrication processes.

Download the Kalrez® 9300 Technical Data Sheet

Review the technical data sheet below for detailed information regarding material properties, operating temperatures, plasma resistance, and recommended semiconductor applications. If you need assistance selecting the right Kalrez® compound for your process, the sealing specialists at M&P Sealing are available to help identify the best solution for your application.